Micro Transfer Printing System

A Tender Notice
by UNIVERSITY OF SHEFFIELD

Source
Contracts Finder
Type
Contract (Products)
Duration
11 month
Value
£650K
Sector
INDUSTRIAL
Published
07 Oct 2022
Delivery
02 Jan 2023 to 30 Nov 2023
Deadline
08 Nov 2022 12:00

Concepts

Location

Geochart for 1 buyers and 0 suppliers

1 buyer

Description

The EPSRC National Epitaxy Facility (NEF) at the University of Sheffield supplies a wide range of III-V semiconductor materials and devices primarily to the UK academic research community. The NEF also engages in significant activity researching and developing new materials and structures. A key direction in this area is the heterogeneous integration of III-V and silicon based photonic and opto-electronic devices. For this purpose the NEF requires a full, turn-key micro transfer printing (MTP) system suitable for highly-accurate, large-scale, parallel transfer of devices from a source wafer to a target wafer. This system must meet all the essential technical requirements set out within the tender documents.

CPV Codes

  • 31000000 - Electrical machinery, apparatus, equipment and consumables; lighting
  • 31100000 - Electric motors, generators and transformers
  • 31200000 - Electricity distribution and control apparatus
  • 31300000 - Insulated wire and cable
  • 31400000 - Accumulators, primary cells and primary batteries
  • 31500000 - Lighting equipment and electric lamps
  • 31600000 - Electrical equipment and apparatus
  • 31700000 - Electronic, electromechanical and electrotechnical supplies
  • 31710000 - Electronic equipment
  • 31711000 - Electronic supplies
  • 31712000 - Microelectronic machinery and apparatus and microsystems
  • 31712100 - Microelectronic machinery and apparatus
  • 31712110 - Electronic integrated circuits and microassemblies
  • 31712111 - Phone cards
  • 31712112 - SIM cards
  • 31712113 - Cards containing integrated circuits
  • 31712114 - Integrated electronic circuits
  • 31712115 - Microassemblies
  • 31712116 - Microprocessors
  • 31712117 - Integrated circuit packages
  • 31712118 - Integrated circuit sockets or mounts
  • 31712119 - Integrated circuit lids
  • 31712200 - Microsystems
  • 31712300 - Printed circuits
  • 31712310 - Populated printed circuit boards
  • 31712320 - Unpopulated printed circuit boards
  • 31712330 - Semiconductors
  • 31712331 - Photovoltaic cells
  • 31712332 - Thyristors
  • 31712333 - Diacs
  • 31712334 - Triacs
  • 31712335 - Optical coupled isolators
  • 31712336 - Crystal oscillators
  • 31712340 - Diodes
  • 31712341 - Light-emitting diodes
  • 31712342 - Microwave or small signal diodes
  • 31712343 - Zener diodes
  • 31712344 - Schottky diodes
  • 31712345 - Tunnel diodes
  • 31712346 - Photosensitive diodes
  • 31712347 - Power or solar diodes
  • 31712348 - Laser diodes
  • 31712349 - Radio frequency (RF) diodes
  • 31712350 - Transistors
  • 31712351 - Photo sensitive transistors
  • 31712352 - Field effect transistors (FET)
  • 31712353 - Metal oxide field effect transistors (MOSFET)
  • 31712354 - Transistor chips
  • 31712355 - Bipolar darlington or radio frequency (RF) transistors
  • 31712356 - Unijunction transistors
  • 31712357 - Insulated gate bipolar transistors (IGBT)
  • 31712358 - Junction field effect transistors (JFET)
  • 31712359 - Bipolar junction transistors (BJT)
  • 31712360 - Mounted piezo-electric crystals
  • 31720000 - Electromechanical equipment
  • 31730000 - Electrotechnical equipment

Indicators

  • Contract is suitable for SMEs.
  • Contract is suitable for VCOs.

Other Information

All tender documents, correspondence & tender returns must be downloaded & submitted via the In-tend site from the link shown above. In-tend e.tendering portal https://in-tendhost.co.uk/sheffield/aspx/Home

Reference

Domains