UKRI-3154 Indium deposition system

Concepts

• indium
• swindon

Location

Description

STFC Interconnect provides a range of electronic and detector assembly techniques to scientific communities within STFC and our external collaborations. We have developed a process to perform surface preparation and make micro bumps of pure Indium metal, on a range of substrates including semiconductor wafers and semiconductor die.The resulting bumps are then used in our proprietary flip chip process to make many thousands or tens-of-thousands of electrical/mechanical connections in a single bonding step.The deposition process involves masking prior to deposition, then deposition, followed by removal of masked areas, leaving the desired bumps in place. Photo lithography (negative resist, lift-off) and shadow masking techniques are both used. We are now scaling this process into production and need new equipment capable of depositing on multiple substrates per day.

CPV Codes

• 14763000 - Indium

Indicators

• Contract is suitable for SMEs.

Other Information

Please follow this link to view the notice https://www.delta-esourcing.com/tenders/UK-UK-Swindon:-Indium./2J2786X87G