904 - Compound Semiconductor Plasma Processing Equipment
A Tender Notice
by ASTON UNIVERSITY
- Source
- Find a Tender
- Type
- Contract (Supply)
- Duration
- 4 year
- Value
- 1M
- Sector
- INDUSTRIAL
- Published
- 28 Nov 2023
- Delivery
- 01 Nov 2024 to 31 Oct 2028
- Deadline
- 12 Jan 2024 12:00
Concepts
Location
Birmingham
Geochart for 2 buyers and 0 suppliers
2 buyers
- Aston University Birmingham
Description
The College of Engineering and Physical Sciences (EPS) at Aston university is creating a III-V semiconductor fabrication facility. As a consequence, we are seeking a single supplier to provide a suite of plasma processing tools for: • ICP Etch of semiconductor materials (e.g. GaAs, GaN, InP, GaSb) • RIE Etch of dielectric materials (e.g. SiO2, SiNx) and metals (e.g. Au, Ge, Cr, Ti, Pt, Pd) • Deposition of dielectric layers (e.g. SiO2, SiNx) The full project specific requirements and equipment specification can be found within the project question set on Aston University’s e-tendering portal ProContract under Section 11 – Project Specific Requirements.
CPV Codes
- 38000000 - Laboratory, optical and precision equipments (excl. glasses)
Indicators
- Bids should cover the whole contract.
- Renewals are not available.
- Award on basis of price and quality.
Reference
- FTS 035128-2023