Silicon Wafers for Test Chips

Concepts

• milton keynes
• silicon wafers
• testing
• silicon
• test chips
• three experimental test chips
• any remaining silicon wafers
• test
• chips
• wafers

Location

Description

As part of the existing Technology Development Element (TDE) contract with the European Space Agency (ESA), the Open University (OU), in company with Teledyne-e2v, are required to procure and test three experimental test chips for characterisation and testing. Phase 1: To procure Silicon wafers for the manufacture of Front Side Illuminated (FSI) soft X-ray Complementary Metal Oxide Semiconductor (CMOS) imaging detectors to characterise their Electro Optical (EO) performance both pre and post irradiation. Phase 2: A potential second phase subject to funding to process any remaining Silicon wafers from the first phase for the manufacture of Back Side Illuminated (BSI) soft X-ray CMOS imaging detectors to characterise their EO performance both pre and post irradiation. Phase 3: A potential third phase subject to funding to procure Silicon wafers to manufacture another batch of either FSI or BSI soft X-ray CMOS imaging detectors for further characterisation of their EO performance both pre and post irradiation. Cost Phase 1: £220,000 Phase 2: £250,000 Phase 3: £350,00 Total: £820,000

Award Detail

CPV Codes

• None found

Other Information

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