Silicon Wafers for Test Chips

Concepts

• milton keynes
• silicon wafers
• testing
• silicon
• test chips
• three experimental test chips
• any remaining silicon wafers
• test
• chips
• wafers

Location

Description

As part of the existing Technology Development Element (TDE) contract with the European Space Agency (ESA), the Open University (OU), in company with Teledyne-e2v, are required to procure and test three experimental test chips for characterisation and testing. Phase 1: To procure Silicon wafers for the manufacture of Front Side Illuminated (FSI) soft X-ray Complementary Metal Oxide Semiconductor (CMOS) imaging detectors to characterise their Electro Optical (EO) performance both pre and post irradiation. Phase 2: A potential second phase subject to funding to process any remaining Silicon wafers from the first phase for the manufacture of Back Side Illuminated (BSI) soft X-ray CMOS imaging detectors to characterise their EO performance both pre and post irradiation. Phase 3: A potential third phase subject to funding to procure Silicon wafers to manufacture another batch of either FSI or BSI soft X-ray CMOS imaging detectors for further characterisation of their EO performance both pre and post irradiation. Cost Phase 1: £220,000 Phase 2: £250,000 Phase 3: £350,00 Total: £820,000

Award Detail

CPV Codes

• None found

Legal Justification

The following conditions are met in relation to the public contract- a) due to an absence of competition for technical reasons, only a particular supplier can supply the goods, services or works required, and b) there are no reasonable alternatives to those goods, services or works. Teledyne-e2v have previously performed a competitor analysis and based on a comparison of price and technical performance, XFAB were selected as the preferred supplier for all their silicon chip products. As a result, Teledyne's CMOS imaging device design and manufacturing plans for this project have been developed to align with XFAB's design rules and processes. Consequently, in order to meet the requirements of the ESA agreement the OU must procure wafers from XFAB to ensure compatibility with Teledyne's design and manufacturing standards.

Other Information

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