Open Air Diffusion Bonding Technology

Concepts

• abingdon
• air diffusion bonding technology
• the open-air diffusion bonding technology
• air
• bonding
• technology
• diffusion
• industrial applications
• fusion application
• large-scale tungsten components

Location

Description

The open-air diffusion bonding technology presents a unique approach to manufacture of large-scale tungsten components. Unlike both traditional and advanced methods, this technique eliminates the need for vacuum conditions or tightly controlled atmospheres, thereby offering a more scalable and cost-effective solution for industrial applications. 7-month project for continuation of technical work that will further the Intellectual Property application related to open air diffusion bonding technology for fusion application.

Award Detail

CPV Codes

• None found

Legal Justification

Imperial College London hold the initial patent (P78409GB) on the technology under consideration and have carried out technology development work on the process for fusion (STEP) application (FY 24-25) under the Manufacturing Framework (project ID: MFFW034). To work directly with ICL is considered the best-value option due to the pre-existing foundation of technical knowledge and associated background IP owned by ICL.

Other Information

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