CSP25458 - Compact wafer bonder

A Contract Award Notice
by UK RESEARCH AND INNOVATION

Source
Find a Tender
Type
Contract ()
Duration
not specified
Value
£37K
Sector
MISCELLANEOUS
Published
22 Oct 2025
Delivery
not specified
Deadline
n/a

Concepts

Location

Geochart for 1 buyers and 1 suppliers

1 buyer

1 supplier

Description

***** THIS IS A CONTRACT DETAILS NOTICE, NOT A CALL FOR COMPETITION ***** This procurement is being concluded following a limited competition procurement exercise. Contract details notice for the supply of Compact Vacuum Hot Flat Press for Wafer Bonding, Dry & Oil-Free Scroll Pump, Digital temperature controlled recirculating water chiller and delivery to UKRI

Award Detail

1 Pi Kem (Tamworth)
  • CSP25458
  • Reference: 1
  • Value: £37,215

CPV Codes

  • None found

Other Information

** PREVIEW NOTICE, please check Find a Tender for full details. **

Reference

Domains